Invention Grant
- Patent Title: Cell to heat sink thermal adhesive
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Application No.: US16886407Application Date: 2020-05-28
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Publication No.: US11881552B2Publication Date: 2024-01-23
- Inventor: Matthew R. Tyler , Xugang Zhang
- Applicant: CPS Technology Holdings LLC
- Applicant Address: US NY New York
- Assignee: CPS Technology Holdings LLC
- Current Assignee: CPS Technology Holdings LLC
- Current Assignee Address: US NY New York
- Agency: Boardman & Clark LLP
- Main IPC: H01M10/0525
- IPC: H01M10/0525 ; H01M10/613 ; H01M10/625 ; H01M10/653 ; H01M10/6551 ; H01M10/6554 ; H01M10/04 ; C09J163/00 ; H01M10/058 ; H01M10/6555 ; H01M50/24 ; H01M50/267 ; H01M50/55 ; H01M50/553 ; H01M10/658 ; H01M50/209 ; H01M50/264 ; H01M10/647 ; H01M50/507 ; H01M50/516

Abstract:
A battery module includes a housing having an opening and an electrochemical cell disposed in the housing. The electrochemical cell includes a first cell surface having electrode terminals and an second cell surface substantially opposite the first cell surface. The battery module also includes a heat sink integral with the housing and a thermally conductive adhesive bonded to the second cell surface and a heat sink surface that is facing the second cell surface. The thermally conductive adhesive can include a bonding shear strength and bonding tensile strength between the electrochemical cell and the heat sink of between approximately 5 megaPascals (MPa) and 50 MPa.
Public/Granted literature
- US20200295325A1 CELL TO HEAT SINK THERMAL ADHESIVE Public/Granted day:2020-09-17
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