Invention Grant
- Patent Title: Thermoelectric conversion module
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Application No.: US17913522Application Date: 2021-03-18
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Publication No.: US11882766B2Publication Date: 2024-01-23
- Inventor: Wataru Morita , Kunihisa Kato , Yuta Seki
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Element IP, PLC
- Priority: JP 20058852 2020.03.27
- International Application: PCT/JP2021/011112 2021.03.18
- International Announcement: WO2021/193358A 2021.09.30
- Date entered country: 2022-09-22
- Main IPC: H10N10/852
- IPC: H10N10/852 ; H10N10/17 ; H10N10/857

Abstract:
A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.
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