-
公开(公告)号：US11882766B2
公开(公告)日：2024-01-23
申请号：US17913522
申请日：2021-03-18
Applicant: LINTEC CORPORATION
Inventor： Wataru Morita , Kunihisa Kato , Yuta Seki
IPC: H10N10/852 , H10N10/17 , H10N10/857
CPC classification number: H10N10/852 , H10N10/17 , H10N10/857
Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.
-
2.发明授权公开(公告)号：US09944831B2
公开(公告)日：2018-04-17
申请号：US15021094
申请日：2014-09-24
Applicant: LINTEC CORPORATION
Inventor： Wataru Morita , Kunihisa Kato , Tsuyoshi Mutou
IPC: C09J7/00 , C09J9/02 , H01L35/32 , C09J9/00 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , H01L35/30 , H01L35/34 , C08G18/62 , C08G18/81 , C08K3/08 , C08K3/22 , C08K3/28 , C08K3/38
CPC classification number: C09J7/00 , C08G18/6229 , C08G18/6254 , C08G18/8116 , C08K3/08 , C08K3/22 , C08K3/28 , C08K2003/385 , C08K2201/001 , C09J7/10 , C09J9/00 , C09J9/02 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , C09J2201/40 , C09J2203/326 , C09J2205/102 , C09J2475/00 , C09J2483/00 , H01L35/30 , H01L35/32 , H01L35/34
Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.
-
Patent Agency Ranking
公开(公告)号：US11581470B2
公开(公告)日：2023-02-14
申请号：US17271057
申请日：2019-08-27
Applicant: LINTEC CORPORATION
Inventor： Wataru Morita , Kunihisa Kato , Tsuyoshi Muto , Yuma Katsuta
Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.
-
公开(公告)号：US11522114B2
公开(公告)日：2022-12-06
申请号：US16467745
申请日：2017-12-07
Applicant: LINTEC CORPORATION
Inventor： Kunihisa Kato , Wataru Morita , Tsuyoshi Mutou , Yuma Katsuta , Takeshi Kondo
Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.
-
公开(公告)号：US11424397B2
公开(公告)日：2022-08-23
申请号：US16493345
申请日：2018-03-13
Applicant: LINTEC CORPORATION
Inventor： Kunihisa Kato , Wataru Morita , Tsuyoshi Muto , Yuma Katsuta
Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material. The electrode material for thermoelectric conversion modules includes a first substrate and a second substrate facing each other, a thermoelectric element formed between the first substrate and the second substrate, and an electrode formed on at least one substrate of the first substrate and the second substrate, wherein the substrate is a plastic film, the thermoelectric element contains a bismuth-tellurium-based thermoelectric semiconductor material, a telluride-based thermoelectric semiconductor material, an antimony-tellurium-based thermoelectric semiconductor material, or a bismuth-selenide-based thermoelectric semiconductor material, the electrode that is in contact with the thermoelectric element is formed of a metal material, and the metal material is gold, nickel, aluminum, rhodium, platinum, chromium, palladium, stainless steel, molybdenum or an alloy containing any of these metals.
-
公开(公告)号：US12114568B2
公开(公告)日：2024-10-08
申请号：US18034430
申请日：2021-10-28
Applicant: LINTEC CORPORATION
Inventor： Yuta Seki , Kunihisa Kato , Wataru Morita , Mutsumi Masumoto
IPC: H10N10/01 , H10N10/17 , H10N10/857
CPC classification number: H10N10/01 , H10N10/17 , H10N10/857
Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).
-
公开(公告)号：US11581471B2
公开(公告)日：2023-02-14
申请号：US17282047
申请日：2019-10-02
Applicant: LINTEC CORPORATION
Inventor： Tsuyoshi Muto , Kunihisa Kato , Taku Nemoto , Wataru Morita , Yuta Seki
Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.
-
-
-
-
-
-
Search Results
7
records
(took 0.013 seconds)
