Invention Grant
- Patent Title: Electrostatic chuck device
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Application No.: US16649969Application Date: 2018-09-26
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Publication No.: US11887877B2Publication Date: 2024-01-30
- Inventor: Mamoru Kosakai , Masaki Ozaki , Keisuke Maeda
- Applicant: SUMITOMO OSAKA CEMENT CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Merchant & Gould P.C.
- Priority: JP 17189718 2017.09.29 JP 17189719 2017.09.29
- International Application: PCT/JP2018/035627 2018.09.26
- International Announcement: WO2019/065710A 2019.04.04
- Date entered country: 2020-03-23
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/3065 ; H01L21/67 ; H01L21/768 ; H01J37/32 ; H02N13/00

Abstract:
An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0Ω/□ and lower than 1.0×1010Ω/□.
Public/Granted literature
- US20200266088A1 ELECTROSTATIC CHUCK DEVICE Public/Granted day:2020-08-20
Information query
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