Invention Grant
- Patent Title: Laser ablation device and analysis apparatus
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Application No.: US17047682Application Date: 2018-04-18
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Publication No.: US11892428B2Publication Date: 2024-02-06
- Inventor: Takao Nakagawa , Norio Yasuda
- Applicant: S.T.JAPAN INC.
- Applicant Address: JP Tokyo
- Assignee: S.T.JAPAN INC.
- Current Assignee: S.T.JAPAN INC.
- Current Assignee Address: JP Tokyo
- Agency: HAUPTMAN HAM, LLP
- International Application: PCT/JP2018/016026 2018.04.18
- International Announcement: WO2019/202689A 2019.10.24
- Date entered country: 2020-10-14
- Main IPC: G01N27/623
- IPC: G01N27/623 ; B23K26/0622 ; B23K26/40 ; G01N21/63 ; G01N1/04 ; G01N1/38 ; G01N1/28 ; B23K103/00 ; G01N21/73

Abstract:
A laser ablation device is provided with: a laser light source that outputs a femtosecond pulse laser beam; an optical system that includes a first mirror rotatable about a first axis, a second mirror rotatable about a second axis, a first driving source for rotating the first mirror about the first axis, and a second driving source for rotating the second mirror about the second axis, and that reflects the laser beam from the laser light source toward a sample by the first mirror and the second mirror; and an irradiation controller that, on the basis of the two-dimensional coordinate position of an analysis position, controls the first driving source and the second driving source to irradiate the analysis position with the laser beam.
Public/Granted literature
- US20210162549A1 LASER ABLATION DEVICE AND ANALYSIS APPARATUS Public/Granted day:2021-06-03
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