Invention Grant
- Patent Title: Ion milling device
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Application No.: US17252997Application Date: 2018-06-22
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Publication No.: US11894213B2Publication Date: 2024-02-06
- Inventor: Asako Kaneko , Hisayuki Takasu
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- International Application: PCT/JP2018/023782 2018.06.22
- International Announcement: WO2019/244331A 2019.12.26
- Date entered country: 2020-12-16
- Main IPC: H01J37/20
- IPC: H01J37/20 ; H01J37/08 ; H01J37/09 ; H01J37/147 ; H01J37/305

Abstract:
An ion milling device capable of high-speed milling is realized even for a specimen containing a material having an imide bond. Therefore, the ion milling device includes: a vacuum chamber 6 configured to hold a specimen 3 in a vacuum atmosphere; an ion gun 1 configured to irradiate the specimen with a non-focused ion beam 2; a vaporization container 17 configured to store a mixed solution 13 of a water-soluble ionic liquid and water; and nozzles 11, 12 configured to supply water vapor obtained by vaporizing the mixed solution to a vicinity of a surface of the specimen processed by the ion beam.
Public/Granted literature
- US20210265130A1 Ion Milling Device Public/Granted day:2021-08-26
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