Method of forming perovskite thin film and light-emitting device including layer manufactured thereby

Invention Grant

US11895903B2 Method of forming perovskite thin film and light-emitting device including layer manufactured thereby 有权

Patent Title: Method of forming perovskite thin film and light-emitting device including layer manufactured thereby
Application No.: US17506448

Application Date: 2021-10-20
Publication No.: US11895903B2

Publication Date: 2024-02-06
Inventor: Yoonseok Ka , Dongchan Kim , Jiyoung Moon , Heechang Yoon
Applicant: Samsung Display Co., Ltd.
Applicant Address: KR Yongin-si
Assignee: Samsung Display Co., Ltd.
Current Assignee: Samsung Display Co., Ltd.
Current Assignee Address: KR Yongin-si
Agency: H.C. Park & Associates, PLC
Priority: KR 20210046090 2021.04.08
Main IPC: H01L23/00
IPC: H01L23/00 ; H10K71/15 ; C09K11/61 ; H10K50/15 ; H10K50/16 ; H10K50/17 ; H10K71/00

Abstract:

A method of forming a perovskite thin film and a light-emitting device including a layer manufactured by the method.

Public/Granted literature

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Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）