Invention Grant
- Patent Title: Enclosed cavity structures
-
Application No.: US17246099Application Date: 2021-04-30
-
Publication No.: US11897760B2Publication Date: 2024-02-13
- Inventor: Ronald S. Cok , Raja Fazan Gul , António José Marques Trindade
- Applicant: X-Celeprint Limited
- Applicant Address: IE Dublin
- Assignee: X-Celeprint Limited
- Current Assignee: X-Celeprint Limited
- Current Assignee Address: IE Dublin
- Agency: Choate, Hall & Stewart LLP
- Agent Michael D. Schmitt
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; H10N30/02 ; H10N30/88

Abstract:
An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
Public/Granted literature
- US20210246018A1 ENCLOSED CAVITY STRUCTURES Public/Granted day:2021-08-12
Information query