公开(公告)号：US12118952B2

公开(公告)日：2024-10-15

申请号：US18122689

申请日：2023-03-16

申请人： LG Display Co., Ltd.

发明人： Seulki Nam ,  Jeonggoo Kang ,  Taehyung Kim

IPC分类号： H04R7/04 ,  G09G3/34 ,  H04R1/02 ,  H04R17/00 ,  H10N30/80 ,  H10N30/87 ,  H10N30/88

CPC分类号： G09G3/3493 ,  H04R1/028 ,  H04R7/045 ,  H04R17/00 ,  H10N30/802 ,  H10N30/871 ,  H10N30/88 ,  G09G2330/028 ,  H04R2499/15

摘要： An apparatus includes a vibration member and a first cover disposed at a rear surface of the vibration member. The apparatus also includes a first vibration apparatus disposed at a rear surface of the first cover and configured to vibrate the vibration member. The apparatus includes a first enclosure member disposed at the rear surface of the first cover and at the rear surface of the vibration member. The apparatus also includes a first rear vibration member disposed at the first enclosure member.

公开(公告)号：US12088253B2

公开(公告)日：2024-09-10

申请号：US18181094

申请日：2023-03-09

申请人： SEIKO EPSON CORPORATION

发明人： Koichi Mizugaki

IPC分类号： H03B5/32 ,  H03B1/02 ,  H03B5/04 ,  H03L1/02 ,  H03L1/04 ,  H05K1/11 ,  H05K1/18 ,  H10N30/88

CPC分类号： H03B5/32 ,  H03B1/02 ,  H03B5/04 ,  H03L1/028 ,  H03L1/04 ,  H05K1/111 ,  H05K1/181 ,  H10N30/88 ,  H05K2201/10083

摘要： A circuit board includes: a semiconductor substrate including a first surface and a second surface located at an opposite side from the first surface; a circuit provided at a first surface side; a first external electrode provided at a second surface side; a heater provided at the second surface side; and a plurality of through electrodes penetrating the first surface and the second surface and electrically coupling the circuit and the first external electrode or the heater. The heater and the first external electrode do not overlap each other in a plan view.

公开(公告)号：US12081194B2

公开(公告)日：2024-09-03

申请号：US18192312

申请日：2023-03-29

申请人： Qorvo US, Inc.

发明人： Alireza Tajic ,  Paul Stokes ,  Robert Aigner

IPC分类号： H03H9/13 ,  H03H9/02 ,  H03H9/17 ,  H03H9/54 ,  H10N30/87 ,  H10N30/88

CPC分类号： H03H9/132 ,  H03H9/02062 ,  H03H9/02086 ,  H03H9/173 ,  H03H9/175 ,  H03H9/54 ,  H10N30/87 ,  H10N30/883

摘要： Bulk acoustic wave (BAW) resonators and particularly top electrodes with step arrangements for BAW resonators are disclosed. Top electrodes on piezoelectric layers are disclosed that include a border (BO) region with a dual-step arrangement where an inner step and an outer step are formed with increasing heights toward peripheral edges of the top electrode. Dielectric spacer layers may be provided between the outer steps and the piezoelectric layer. Passivation layers are disclosed that extend over the top electrode either to peripheral edges of the piezoelectric layer or that are inset from peripheral edges of the piezoelectric layer. Piezoelectric layers may be arranged with reduced thickness portions in areas that are uncovered by top electrodes. BAW resonators as disclosed herein are provided with high quality factors and suppression of spurious modes while also providing weakened BO modes that are shifted farther away from passbands of such BAW resonators.

公开(公告)号：US12075211B2

公开(公告)日：2024-08-27

申请号：US17946825

申请日：2022-09-16

申请人： FUJIFILM Corporation

发明人： Teruo Ashikawa ,  Kazuo Hiraguchi ,  Yusuke Kagawa ,  Tetsu Miyoshi

IPC分类号： H04R17/00 ,  H10N30/50 ,  H10N30/87 ,  H10N30/88

CPC分类号： H04R17/00 ,  H10N30/50 ,  H10N30/872 ,  H10N30/883

摘要： Provided are a laminated piezoelectric element and an electroacoustic transducer capable of obtaining high piezoelectric characteristics and easily ensuring an electric contact to an electrode layer. A plurality of layers of piezoelectric films, each of which is formed by laminating a first protective layer, a first electrode layer, a piezoelectric layer, a second electrode layer, and a second protective layer in this order, are laminated. Each of the piezoelectric layers is polarized in a thickness direction. In each of the piezoelectric films, the first electrode is disposed on an upstream side in a polarization direction of the piezoelectric layer, and the second electrode is disposed on a downstream side. Each of the plurality of piezoelectric films has a cemented portion which is cemented to an adjacent piezoelectric film and a protruding portion which is not cemented to the adjacent piezoelectric film and in which at least the first electrode layer and the first protective layer or the second electrode layer and the second protective layer protrude from the cemented portion toward the outside in a plane direction. At the protruding portion of each of the piezoelectric films, at least one of a first contact, to which the first electrode layers of the piezoelectric films are electrically connected to each other, or a second contact, to which the second electrode layers of the piezoelectric films are electrically connected to each other, is formed.

公开(公告)号：US20240260476A1

公开(公告)日：2024-08-01

申请号：US18595568

申请日：2024-03-05

申请人： FUJIFILM Corporation

发明人： Tetsu MIYOSHI

IPC分类号： H10N30/50 ,  H10N30/072 ,  H10N30/85 ,  H10N30/88

CPC分类号： H10N30/50 ,  H10N30/072 ,  H10N30/85 ,  H10N30/883

摘要： An object of the present invention is to provide a piezoelectric film and a laminated piezoelectric element, in which, in a piezoelectric film including electrode layers and protective layers on both surfaces of a piezoelectric layer containing piezoelectric particles in a matrix containing a polymer material, changes in mechanical properties and electrical properties due to a humidity of an external environment can be reduced. The piezoelectric film includes a piezoelectric layer containing piezoelectric particles in a matrix containing a polymer material, electrode layers provided on both surfaces of the piezoelectric layer, and a protective layer provided on a surface of the electrode layer opposite to the piezoelectric layer, in which the protective layer has a resin substrate and at least one inorganic layer provided on the resin substrate, and a water vapor transmission rate of the piezoelectric film is 1×10−4 g/(m2×day) or less.

公开(公告)号：US20240188445A1

公开(公告)日：2024-06-06

申请号：US18554736

申请日：2022-03-30

申请人： Kureha Corporation

发明人： Makoto IMAJI

IPC分类号： H10N30/87 ,  G06F3/041 ,  H10N30/06 ,  H10N30/857 ,  H10N30/88

CPC分类号： H10N30/878 ,  H10N30/06 ,  H10N30/857 ,  H10N30/883 ,  G06F3/041 ,  G06F2203/04105

摘要： Provided is a transparent conductive piezoelectric laminate film that achieves high transparency and low resistance. The present invention relates to a transparent conductive piezoelectric laminate film including a piezoelectric film, and a conductor layer layered on at least one surface of the piezoelectric film. The transparent conductive piezoelectric laminate film has a diffraction peak in each of a range of 21°±2° and a range of 31°±2° in X-ray diffraction measurement, and a haze value of 2.0% or less.

公开(公告)号：US20240165950A1

公开(公告)日：2024-05-23

申请号：US18509716

申请日：2023-11-15

申请人： SEIKO EPSON CORPORATION

发明人： Eiju HIRAI ,  Motoki TAKABE ,  Masaki MORI

IPC分类号： B41J2/14 ,  B41J2/045 ,  H10N30/87 ,  H10N30/88

CPC分类号： B41J2/14233 ,  B41J2/04566 ,  H10N30/87 ,  H10N30/883 ,  B41J2/04581 ,  B41J2002/14241

摘要： A liquid ejecting head includes: a piezoelectric element that includes a first drive electrode, a second drive electrode, and a piezoelectric body, the piezoelectric body being provided between the first drive electrode and the second drive electrode in a lamination direction; a pressure chamber substrate that is provided on the one side of the lamination direction with respect to the vibration plate; and detection electrodes that acquire information on humidity and include a first detection electrode in contact with a protective film and a second detection electrode in contact with the protective film at a position separated from the first detection electrode.

公开(公告)号：US20240130047A1

公开(公告)日：2024-04-18

申请号：US18338118

申请日：2023-06-20

申请人： ElastiMed Ltd.

发明人： Omer Zelka

IPC分类号： H05K3/20 ,  A61F13/08 ,  B29C53/04 ,  B29C55/14 ,  B32B3/06 ,  B32B3/08 ,  B32B27/08 ,  H05K3/00 ,  H05K3/10 ,  H10N30/04 ,  H10N30/06 ,  H10N30/857 ,  H10N30/87 ,  H10N30/88

CPC分类号： H05K3/207 ,  A61F13/085 ,  B29C53/04 ,  B29C55/14 ,  B32B3/06 ,  B32B3/08 ,  B32B27/08 ,  H05K3/0044 ,  H05K3/103 ,  H10N30/04 ,  H10N30/06 ,  H10N30/857 ,  H10N30/878 ,  H10N30/88 ,  A61B2017/00402

摘要： In some embodiments, the present invention is directed to an actuator which includes at least the following: a pre-stretched electro-active polymer film being pre-stretched in a single or biaxial planar directions; at least one first semi-stiff conductor attached to a first surface of the pre-stretched electro-active polymer film, wherein the first surface is parallel to the single or biaxial planar stretch directions; at least one second semi-stiff conductor attached to a second surface of the pre-stretched electro-active polymer film, wherein the second surface is opposite to the first surface; where the semi-stiff conductors are configured to: fix the pre-stretched electro-active polymer film in a pre-stretched state and allow the pre-stretched electro-active polymer film to expand; a pair of mechanical connectors coupled to each end of an active region of the pre-stretched electro-active polymer film.

公开(公告)号：US11963452B2

公开(公告)日：2024-04-16

申请号：US17103894

申请日：2020-11-24

申请人： VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.

发明人： Jia Jie Xia ,  Rakesh Kumar ,  Minu Prabhachandran Nair ,  Nagarajan Ranganathan

IPC分类号： H10N30/30 ,  B81B3/00 ,  H04R17/02 ,  H10N30/00 ,  H10N30/06 ,  H10N30/082 ,  H10N30/87 ,  H10N30/88 ,  H04R31/00

CPC分类号： H10N30/302 ,  B81B3/001 ,  H04R17/02 ,  H10N30/06 ,  H10N30/082 ,  H10N30/1051 ,  H10N30/308 ,  H10N30/877 ,  H10N30/883 ,  B81B2201/0257 ,  H04R31/00 ,  H04R2201/003 ,  Y10T29/42

摘要： A method of forming a piezoelectric microphone with an interlock/stopper and a micro-bump and a resulting device are provided. Embodiments include forming a membrane over a Si substrate having a first and second sacrificial layer disposed on opposite surfaces thereof, the membrane being formed on the first sacrificial layer, forming a first HM over the membrane, forming first and second vias through the first HM, forming a first pad layer in the first and second vias and over an exposed top thin film, forming a trench to the first sacrificial layer between the first and second vias and a gap between the trench and second via, patterning a second HM over the membrane, in the first and second vias, the trench and the gap, and forming a second pad layer over the second HM and in exposed areas around the first and second vias to form pad structures.

公开(公告)号：US20240099143A1

公开(公告)日：2024-03-21

申请号：US18264318

申请日：2022-01-12

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Toshiaki KURODA ,  Kenji SHIBATA ,  Kazutoshi WATANABE ,  Takeshi KIMURA

IPC分类号： H10N30/03 ,  H10N30/00 ,  H10N30/063 ,  H10N30/076 ,  H10N30/077 ,  H10N30/87 ,  H10N30/88

CPC分类号： H10N30/03 ,  H10N30/063 ,  H10N30/076 ,  H10N30/077 ,  H10N30/1051 ,  H10N30/87 ,  H10N30/883

摘要： There is provided a piezoelectric stack including: a substrate (1); a bottom electrode film (2) on the substrate; a piezoelectric film (3) on the bottom electrode film, having a planar area smaller than a planar area of the bottom electrode film; a top electrode film (4) on the piezoelectric film; and an insulating film (5) provided from the top electrode film to the bottom electrode film and covering at least a part of a side surface of the piezoelectric film, wherein the insulating film has a slope (9a) filling a step between a top surface of the top electrode film and a top surface of the bottom electrode film, and the slope has a shape alleviating the step.