- Patent Title: Ruthenium-etching solution, method for manufacturing ruthenium-etching solution, method for processing object to be processed, and method for manufacturing ruthenium-containing wiring
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Application No.: US17095159Application Date: 2020-11-11
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Publication No.: US11898081B2Publication Date: 2024-02-13
- Inventor: Takuya Ohhashi , Yukihisa Wada
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP 19210515 2019.11.21 JP 20170554 2020.10.08
- Main IPC: C09K13/04
- IPC: C09K13/04 ; H01L21/48 ; C09K13/00 ; H01L21/3213 ; C23F1/14 ; C23F1/40 ; C23F1/00 ; H01L21/306
Abstract:
A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.
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