- 专利标题: Semiconductor device structure and methods of forming the same
-
申请号: US17459101申请日: 2021-08-27
-
公开(公告)号: US11901364B2公开(公告)日: 2024-02-13
- 发明人: Jung-Hung Chang , Zhi-Chang Lin , Shih-Cheng Chen , Chien Ning Yao , Kuo-Cheng Chiang , Chih-Hao Wang
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: NZ CARR LAW OFFICE
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L21/822 ; H01L21/8234
摘要:
A semiconductor device structure, along with methods of forming such, are described. The structure includes a plurality of semiconductor layers having a first group of semiconductor layers, a second group of semiconductor layers disposed over and aligned with the first group of semiconductor layers, and a third group of semiconductor layers disposed over and aligned with the second group of semiconductor layers. The structure further includes a first source/drain epitaxial feature in contact with a first number of semiconductor layers of the first group of semiconductor layers and a second source/drain epitaxial feature in contact with a second number of semiconductor layers of the third group of semiconductor layers. The first number of semiconductor layers of the first group of semiconductor layers is different from the second number of semiconductor layers of the third group of semiconductor layers.
公开/授权文献
信息查询
IPC分类: