A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.