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公开(公告)号：US11902644B2
公开(公告)日：2024-02-13
申请号：US17683305
申请日：2022-02-28
发明人： Jun Dai , Mei Yang , Ming-Jaan Ho
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0306 , H05K1/111 , H05K1/0393
摘要： A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
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公开(公告)号：US11757080B2
公开(公告)日：2023-09-12
申请号：US17260515
申请日：2019-11-27
发明人： Zu-Ai Li , Mei-Hua Huang , Jin-Cheng Wu , Si-Hong He , Ning Hou
IPC分类号： H01L33/62 , H01L25/075 , H01L33/00 , H01L33/38 , H01L33/54
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/005 , H01L33/38 , H01L33/54 , H01L2933/005 , H01L2933/0016 , H01L2933/0066
摘要： The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips. The invention also relates to a method for manufacturing a multi-faceted light-emitting circuit board.
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公开(公告)号：US20230164919A1
公开(公告)日：2023-05-25
申请号：US18094506
申请日：2023-01-09
发明人： SHI-JIE ZHONG
CPC分类号： H05K1/147 , H05K1/119 , H05K3/36 , H05K2201/09063 , H05K2201/091
摘要： A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.
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公开(公告)号：US20230156906A1
公开(公告)日：2023-05-18
申请号：US18097095
申请日：2023-01-13
申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD , Avary Holding (Shenzhen) Co., Limited. , GARUDA TECHNOLOGY CO., LTD.
发明人： XIN LU , WEI-XIANG LI
摘要： A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.
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公开(公告)号：US11553602B2
公开(公告)日：2023-01-10
申请号：US17354478
申请日：2021-06-22
申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD , Avary Holding (Shenzhen) Co., Limited. , GARUDA TECHNOLOGY CO., LTD.
发明人： Yin-Ju Chen , Jing-Cyuan Yang , Yen-Chang Chu
摘要： A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.
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公开(公告)号：US11510319B2
公开(公告)日：2022-11-22
申请号：US17335416
申请日：2021-06-01
发明人： Rui-Wu Liu , Ming-Jaan Ho , Man-Zhi Peng
摘要： A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.
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公开(公告)号：US20220312655A1
公开(公告)日：2022-09-29
申请号：US17684560
申请日：2022-03-02
发明人： FU-YUN SHEN , MING-JAAN HO , HSIAO-TING HSU
摘要： A method for manufacturing an electromagnetic shielding film comprising providing an insulating layer, wherein the insulating layer is metallized to obtain a silver layer; and painting a conductive adhesive on a surface of the silver layer to form a conductive adhesive layer. The conductive adhesive layer comprises bisphenol A diglycidyl ether with a mass percentage between 9.8% and 10.5%, bisphenol S diglycidyl ether with a mass percentage between 4.54% and 4.86%, bisphenol F diglycidyl ether with a mass percentage between 2.27% and 2.43%, polyamide with a mass percentage between 7.11% and 7.62%, silver copper powder with a mass percentage between 48.6% and 68.3%, and silver strips with a mass percentage between 6.44% and 25.9%.
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公开(公告)号：US20220279647A1
公开(公告)日：2022-09-01
申请号：US17748300
申请日：2022-05-19
申请人： Avary Holding (Shenzhen) Co., Limited. , QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD , GARUDA TECHNOLOGY CO., LTD.
发明人： WEI-LIANG WU , JIA-HE LI
摘要： A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.
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公开(公告)号：US20220230973A1
公开(公告)日：2022-07-21
申请号：US17711252
申请日：2022-04-01
发明人： YONG-CHAO WEI , JIA-HE LI
IPC分类号： H01L23/66 , H01L23/552 , H01L23/00 , H01L21/48
摘要： A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.
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10.发明授权公开(公告)号：US11388818B2
公开(公告)日：2022-07-12
申请号：US17029369
申请日：2020-09-23
发明人： Zhi Guo
摘要： A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.
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