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公开(公告)号：US11902644B2
公开(公告)日：2024-02-13
申请号：US17683305
申请日：2022-02-28
发明人： Jun Dai , Mei Yang , Ming-Jaan Ho
CPC分类号： H04N23/54 , H04N23/55 , H05K1/0306 , H05K1/111 , H05K1/0393
摘要： A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
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公开(公告)号：US20220191361A1
公开(公告)日：2022-06-16
申请号：US17683305
申请日：2022-02-28
发明人： Jun Dai , Mei Yang , Ming-Jaan Ho
摘要： A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.
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公开(公告)号：US20240196541A1
公开(公告)日：2024-06-13
申请号：US18425373
申请日：2024-01-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited .
发明人： CHENG-JIA LI , Mei Yang
CPC分类号： H05K3/0097 , H05K3/0026 , H05K3/465 , H05K3/107 , H05K3/385 , H05K3/4038 , H05K3/4053 , H05K3/4076 , H05K2201/0108 , H05K2201/0323 , H05K2203/0152 , H05K2203/1572
摘要： A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.
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公开(公告)号：US11950371B2
公开(公告)日：2024-04-02
申请号：US16966118
申请日：2019-08-22
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Cheng-Jia Li , Mei Yang
CPC分类号： H05K3/0097 , H05K3/0026 , H05K3/465 , H05K3/107 , H05K3/385 , H05K3/4038 , H05K3/4053 , H05K3/4076 , H05K2201/0108 , H05K2201/0323 , H05K2203/0152 , H05K2203/1572
摘要： A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.
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公开(公告)号：US12114424B2
公开(公告)日：2024-10-08
申请号：US17639323
申请日：2020-04-24
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
CPC分类号： H05K1/115 , H05K3/067 , H05K3/423 , H05K2201/09227 , H05K2201/09563
摘要： A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.
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公开(公告)号：US11294285B2
公开(公告)日：2022-04-05
申请号：US16843123
申请日：2020-04-08
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： G03F7/095 , C23C30/00 , H05K3/38 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K1/09 , C23F1/44 , C23F1/02 , G03F7/20
摘要： A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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公开(公告)号：US11234331B2
公开(公告)日：2022-01-25
申请号：US16887463
申请日：2020-05-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Cheng-Jia Li , Mei Yang
摘要： A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board.
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公开(公告)号：US10531578B2
公开(公告)日：2020-01-07
申请号：US15881873
申请日：2018-01-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
摘要： A method for manufacturing a flexible circuit board with resistor which is buried in the board includes steps of providing a composite board, the composite board comprising a substrate, and a physical development core layer formed on the substrate. A silver halide emulsion layer is formed on the physical development core layer and the silver halide emulsion layer is exposed. A developing solution is applied to the halide emulsion layer and washed to form a silver layer on the substrate. A conductive layer is formed on the silver layer and the conductive layer is etched, forming at least one opening. Such opening exposes a portion of the silver layer which contains a buried resistor. Different processes and materials applied in the above procedure serve to increase or decrease the resistance of the resistor as desired.
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公开(公告)号：US12016119B2
公开(公告)日：2024-06-18
申请号：US17542706
申请日：2021-12-06
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Cheng-Jia Li , Mei Yang
CPC分类号： H05K1/09 , H05K1/113 , H05K1/115 , H05K3/02 , H05K3/4608 , H05K3/4673 , H05K2201/0352 , H05K2201/09381 , H05K2201/09518 , H05K2201/0959 , Y10T29/49126
摘要： A method for manufacturing such multilayer printed circuit board includes providing a metal laminated structure including a first type metal layer and a second type metal layer, pressing a patterned dry film layer and a protective film layer on two surfaces of the metal laminated structure, the dry film layer exposing the second type metal layer; etching the second type metal layer to form a first conductive circuit layer; etching a first type metal layer to form a second conductive circuit layer, the first conductive circuit layer and the second conductive circuit layer defining an inner circuit laminated structure; removing the dry film layer; and forming a first adding-layer circuit base board and a second adding-layer circuit base board on two surfaces of the inner laminated structure.
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公开(公告)号：US10653011B2
公开(公告)日：2020-05-12
申请号：US15817052
申请日：2017-11-17
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Mei Yang , Jun Dai
IPC分类号： H05K1/09 , H05K3/38 , H05K3/46 , H05K3/06 , C23G1/10 , C23C28/02 , H05K3/40 , H05K3/18 , H05K3/00 , C23F1/44 , C23F1/02 , G03F7/20 , G03F7/095
摘要： A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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