Invention Grant
- Patent Title: Light-emitting diode package and electronic device including the same
-
Application No.: US17243816Application Date: 2021-04-29
-
Publication No.: US11908982B2Publication Date: 2024-02-20
- Inventor: Jongsup Song , Tetsuo Ariyoshi , Taehyun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200128955 2020.10.06
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L33/46 ; H01L33/48 ; H01L33/58 ; H01L33/62 ; H01L33/50 ; H01L33/60 ; G02B3/08 ; F21V8/00
Abstract:
A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.
Public/Granted literature
- US20220109089A1 LIGHT-EMITTING DIODE PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2022-04-07
Information query
IPC分类:
