Invention Grant
- Patent Title: Semiconductor device with voltage resistant structure
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Application No.: US17575148Application Date: 2022-01-13
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Publication No.: US11929394B2Publication Date: 2024-03-12
- Inventor: Yuki Nakano , Ryota Nakamura
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: XSENSUS LLP
- Priority: JP 13043406 2013.03.05
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L29/16 ; H01L29/20 ; H01L29/36 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/49 ; H01L29/51 ; H01L29/78

Abstract:
A semiconductor device of the present invention includes a semiconductor layer of a first conductivity type having a cell portion and an outer peripheral portion disposed around the cell portion, formed with a gate trench at a surface side of the cell portion, and a gate electrode buried in the gate trench via a gate insulating film, forming a channel at a portion lateral to the gate trench at ON-time, the outer peripheral portion has a semiconductor surface disposed at a depth position equal to or deeper than a depth of the gate trench, and the semiconductor device further includes a voltage resistant structure having a semiconductor region of a second conductivity type formed in the semiconductor surface of the outer peripheral portion.
Public/Granted literature
- US20220140072A1 SEMICONDUCTOR DEVICE WITH VOLTAGE RESISTANT STRUCTURE Public/Granted day:2022-05-05
Information query
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