Invention Grant
- Patent Title: Adhesive composition for dicing tape and dicing tape comprising the same
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Application No.: US17598114Application Date: 2020-08-13
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Publication No.: US11932784B2Publication Date: 2024-03-19
- Inventor: Da Ae Kim , Ji Ho Han , Kwang Joo Lee , Eun Yeong Kim , Mi Jang
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: ROTHWELL, FIGG, ERNST & MANBECK, P.C.
- Priority: KR 20190119119 2019.09.26 KR 20200096318 2020.07.31
- International Application: PCT/KR2020/095102 2020.08.13
- International Announcement: WO2021/060960A 2021.04.01
- Date entered country: 2021-09-24
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C08K5/00 ; C08K5/03 ; C09J7/24 ; C09J7/25 ; C09J11/06 ; H01L21/683
Abstract:
The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
Public/Granted literature
- US20220186092A1 ADHESIVE COMPOSITION FOR DICING TAPE AND DICING TAPE COMPRISING THE SAME Public/Granted day:2022-06-16
Information query
IPC分类:
