公开(公告)号：US11932784B2

公开(公告)日：2024-03-19

申请号：US17598114

申请日：2020-08-13

Applicant: LG CHEM, LTD.

Inventor： Da Ae Kim ,  Ji Ho Han ,  Kwang Joo Lee ,  Eun Yeong Kim ,  Mi Jang

IPC: C09J133/08 ,  C08K5/00 ,  C08K5/03 ,  C09J7/24 ,  C09J7/25 ,  C09J11/06 ,  H01L21/683

CPC classification number: C09J133/08 ,  C08K5/0025 ,  C08K5/03 ,  C09J7/24 ,  C09J7/241 ,  C09J7/25 ,  C09J11/06 ,  H01L21/6836 ,  C08K5/005 ,  C08K2201/012 ,  C09J2203/326 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2423/006 ,  C09J2433/00 ,  H01L2221/68327

Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

公开(公告)号：US12065595B2

公开(公告)日：2024-08-20

申请号：US16966696

申请日：2019-04-11

Applicant: LG CHEM, LTD.

Inventor： Sera Kim ,  Ji Ho Han ,  Mi Jang ,  Kwang Joo Lee

IPC: C09J7/32 ,  C09J7/24 ,  C09J7/25 ,  C09J7/40 ,  C09J133/14 ,  H01L21/683 ,  C08K5/29 ,  C08K5/5397

CPC classification number: C09J7/243 ,  C09J7/255 ,  C09J7/40 ,  C09J133/14 ,  H01L21/6836 ,  C08K5/29 ,  C08K5/5397 ,  C09J2301/208 ,  C09J2301/408 ,  C09J2301/416 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/2809 ,  Y10T428/2848 ,  Y10T428/2891

Abstract: The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

公开(公告)号：US12024654B2

公开(公告)日：2024-07-02

申请号：US17286673

申请日：2020-06-12

Applicant: LG CHEM, LTD.

Inventor： Eun Yeong Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Ji Ho Han ,  Bora Yeon ,  Mi Jang

IPC: C09J163/00 ,  C09J7/24 ,  H01L23/00 ,  C08K5/29 ,  C09J7/40

CPC classification number: C09J163/00 ,  C09J7/245 ,  H01L24/27 ,  H01L24/29 ,  C08K5/29 ,  C09J7/40 ,  C09J2433/00 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2924/0665

Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

公开(公告)号：US11466184B2

公开(公告)日：2022-10-11

申请号：US17045865

申请日：2019-06-17

Applicant: LG CHEM, LTD.

Inventor： Mi Jang ,  Sera Kim ,  Ji Ho Han ,  Kwang Joo Lee ,  Bora Yeon ,  Kwang Su Seo

IPC: C09J143/04 ,  C09J11/06 ,  C09J183/06 ,  C08F230/08 ,  C08K5/00 ,  C08F8/30 ,  C08K5/17

Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.