Invention Grant
- Patent Title: Inductive devices and methods of fabricating inductive devices
-
Application No.: US17117258Application Date: 2020-12-10
-
Publication No.: US11935678B2Publication Date: 2024-03-19
- Inventor: Zishan Ali Syed Mohammed , Lulu Peng , Chor Shu Cheng , Yong Chau Ng , Lawrence Selvaraj Susai
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDARIES SINGAPORE Pte. Ltd.
- Current Assignee: GLOBALFOUNDARIES SINGAPORE Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: VIERING JENTSCHURA & PARTNER MBB
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/02 ; H01L49/02

Abstract:
An inductive device may be provided, including a first winding layer, a second winding layer arranged over the first winding layer and connected to the first winding layer to form a plurality of turns around a first axis, and a magnetic core arranged vertically between the first winding layer and the second winding layer. The magnetic core may include a portion entirely over the first winding layer and entirely under the second winding layer, where this portion may include a magnetic segment and a non-magnetic segment arranged laterally adjacent to each other along the first axis.
Public/Granted literature
- US20220189673A1 INDUCTIVE DEVICES AND METHODS OF FABRICATING INDUCTIVE DEVICES Public/Granted day:2022-06-16
Information query