Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US17278828Application Date: 2019-10-01
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Publication No.: US11935964B2Publication Date: 2024-03-19
- Inventor: Shunpei Yamazaki , Yoshihiro Komatsu , Toshikazu Ohno
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: NIXON PEABODY LLP
- Agent Jeffrey L. Costellia
- Priority: JP 18193074 2018.10.12
- International Application: PCT/IB2019/058318 2019.10.01
- International Announcement: WO2020/074999A 2020.04.16
- Date entered country: 2021-03-23
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/8234 ; H01L27/06 ; H01L27/12 ; H01L29/786

Abstract:
A semiconductor device having high reliability is provided. The semiconductor device includes a transistor and an insulator placed so as to surround the transistor; the insulator has a barrier property against hydrogen; the transistor includes an oxide and a conductor; the conductor includes nitrogen and a metal; the conductor has a physical property of extracting hydrogen; the conductor includes a region having a hydrogen concentration higher than or equal to 2.0×1019 atoms/cm3 and lower than or equal to 1.0×1021 atoms/cm3; and at least part of hydrogen atoms included in the region is bonded to a nitrogen atom.
Public/Granted literature
- US20220037534A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2022-02-03
Information query
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