Invention Grant
- Patent Title: Cooling device, substrate treatment device, cooling method, and substrate treatment method
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Application No.: US17321639Application Date: 2021-05-17
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Publication No.: US11948812B2Publication Date: 2024-04-02
- Inventor: Kensuke Demura
- Applicant: Shibaura Mechatronics Corporation
- Applicant Address: JP Yokohama
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: PEARNE & GORDON LLP
- Priority: JP 20087862 2020.05.20 JP 21042062 2021.03.16
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/04 ; F25B13/00 ; H01J37/32 ; H01L21/02 ; H01L21/311

Abstract:
According to one embodiment, a cooling device includes a flow path configured to flow a refrigerant, a condenser provided in the flow path, a heat exchanger provided in the flow path, a compressor provided in the flow path between the condenser and the heat exchanger, a cooler cooling the refrigerant flowing from the condenser into the heat exchanger, a gas cooling part supplying a gas to the heat exchanger, and configured to cool the gas by exchanging heat with the refrigerant, a first thermometer configured to detect a temperature of the cooled gas, a second thermometer configured to detect a temperature of the refrigerant flowing into the heat exchanger, and a first controller configured to control the temperature of the cooled refrigerant flowing into the heat exchanger by the cooler. The first controller controls the temperature of the cooled refrigerant by switching a first control and a second control.
Public/Granted literature
- US20210366739A1 COOLING DEVICE, SUBSTRATE TREATMENT DEVICE, COOLING METHOD, AND SUBSTRATE TREATMENT METHOD Public/Granted day:2021-11-25
Information query
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