A pump assembly is presented including a motor housing holding an electric motor and a wet-end housing. The pump assembly also includes a heat transfer interface positioned between a front end of the motor housing and the wet-end housing. The heat transfer interface establishes a thermal conduction path between the motor housing and the wet-end housing so that, in use, a portion of heat generated by the motor is absorbed by the heat transfer interface and is dissipated in water circulating through the wet-end housing. In addition, or alternatively, another thermal conduction path may be established between the heat transfer interface and an electronic controller of the pump assembly so that heat generated by the controller is absorbed by the heat transfer interface and dissipated in water circulating through the wet-end housing. Mounting brackets may be provided at different radial locations about an outside casing of the pump assembly to allow mounting the assembly to a supporting structure in different orientations.