- 专利标题: Semiconductor device
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申请号: US17643558申请日: 2021-12-09
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公开(公告)号: US11973116B2公开(公告)日: 2024-04-30
- 发明人: Johji Nishio , Chiharu Ota
- 申请人: KABUSHIKI KAISHA TOSHIBA
- 申请人地址: JP Tokyo
- 专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP 21079530 2021.05.10 JP 21092078 2021.06.01
- 主分类号: H01L29/16
- IPC分类号: H01L29/16 ; H01L29/04 ; H01L29/167 ; H01L29/78 ; H01L29/861
摘要:
According to one embodiment, a semiconductor device includes a silicon carbide member. The silicon carbide member includes an operating region including at least one of a diode or a transistor, and a first element region including at least one element selected from the group consisting of Ar, V, Al and B. The first element region includes a first region and a second region. A first direction from the first region toward the second region is along a [1-100] direction of the silicon carbide member. The operating region is between the first region and the second region in the first direction. The first element region does not include a region overlapping the operating region in a second direction along a [11-20] direction of the silicon carbide member. Or the first element region includes a third region overlapping the operating region in the second direction.
公开/授权文献
- US20220359665A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-11-10
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