- 专利标题： Electronic device housing and electronic device including the same
-
申请号： US17889898申请日： 2022-08-17
-
公开(公告)号： US11974405B2公开(公告)日： 2024-04-30
- 发明人: Youngmin Moon , Jaehyun Bae , Hyunsuk Choi
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： CANTOR COLBURN LLP
- 优先权： KR 20210114685 2021.08.30
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; B32B1/00 ; B32B3/26 ; B32B3/30 ; B32B5/02 ; B32B7/022 ; B32B7/12 ; B32B9/00 ; B32B9/04 ; B32B15/08 ; B32B15/14 ; B32B17/06 ; B32B17/10 ; B32B27/28 ; B32B37/06 ; B32B37/10 ; B32B38/00
摘要：
An electronic device housing, and an electronic device including the same are provided. The electronic device housing includes a substrate including glass, an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed, and an elastic layer which is between the substrate and the insert portion and extends along the surface of the insert portion.
公开/授权文献
信息查询
