Invention Grant
- Patent Title: Systems and methods for heat dissipation in computing systems with environment resistance
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Application No.: US17730913Application Date: 2022-04-27
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Publication No.: US11974413B2Publication Date: 2024-04-30
- Inventor: Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih , Kang Hsu
- Applicant: Quanta Computer Inc.
- Applicant Address: TW Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan
- Agency: NIXON PEABODY LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H05K5/06
Abstract:
A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
Public/Granted literature
- US20230354556A1 SYSTEMS AND METHODS FOR HEAT DISSIPATION IN COMPUTING SYSTEMS WITH ENVIRONMENT RESISTANCE Public/Granted day:2023-11-02
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