公开(公告)号：US11974413B2

公开(公告)日：2024-04-30

申请号：US17730913

申请日：2022-04-27

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh Chen ,  Yueh-Chang Wu ,  Ching-Yi Shih ,  Kang Hsu

IPC: H05K7/20 ,  G06F1/20 ,  H05K5/06

CPC classification number: H05K7/20409 ,  G06F1/206 ,  H05K5/06

Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

公开(公告)号：US12052846B2

公开(公告)日：2024-07-30

申请号：US17670113

申请日：2022-02-11

Applicant: Quanta Computer Inc.

Inventor： Yi-Chieh Chen ,  Yueh-Chang Wu ,  Ching-Yi Shih ,  Kang Hsu

IPC: H05K7/20 ,  F28D21/00 ,  F28F3/02 ,  F28F21/08

CPC classification number: H05K7/20409 ,  F28D21/00 ,  F28F3/02 ,  F28F21/084 ,  H05K7/20518 ,  H05K7/20727 ,  B23P2700/10 ,  F28D2021/0029

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.