• Patent Title: Power electronics unit comprising a circuit board and a power module, method for producing a power electronics unit, motor vehicle comprising a power electronics unit
  • Application No.: US17623378
    Application Date: 2020-09-07
  • Publication No.: US11990697B2
    Publication Date: 2024-05-21
  • Inventor: Andreas ApelsmeierBenjamin SöhnleDaniel Ruppert
  • Applicant: AUDI AG
  • Applicant Address: DE Ingolstadt
  • Assignee: AUDI AG
  • Current Assignee: AUDI AG
  • Current Assignee Address: DE Ingolstadt
  • Agency: Maier & Maier, PLLC
  • Priority: DE 2019125108.7 2019.09.18
  • International Application: PCT/EP2020/074923 2020.09.07
  • International Announcement: WO2021/052795A 2021.03.25
  • Date entered country: 2021-12-28
  • Main IPC: H01R12/58
  • IPC: H01R12/58 H01R12/52 H05K1/18 H05K3/30 H01R12/57
Power electronics unit comprising a circuit board and a power module, method for producing a power electronics unit, motor vehicle comprising a power electronics unit
Abstract:
Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.
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