- 专利标题: Radiation imaging device, production method for radiation imaging device, and repair method for radiation imaging device
-
申请号: US17283102申请日: 2019-10-09
-
公开(公告)号: US11996434B2公开(公告)日: 2024-05-28
- 发明人: Ryuji Kyushima , Kazuki Fujita , Junichi Sawada , Takao Aritake , Minoru Ichikawa , Haruyoshi Okada , Seiji Fukamizu , Shuhei Namba
- 申请人: HAMAMATSU PHOTONICS K.K.
- 申请人地址: JP Hamamatsu
- 专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人: HAMAMATSU PHOTONICS K.K.
- 当前专利权人地址: JP Hamamatsu
- 代理机构: Faegre Drinker Biddle & Reath LLP
- 优先权: JP 18196742 2018.10.18
- 国际申请: PCT/JP2019/039891 2019.10.09
- 国际公布: WO2020/080233A 2020.04.23
- 进入国家日期: 2021-04-06
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; A61B6/00 ; A61B6/42 ; H04N25/70
摘要:
A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.
公开/授权文献
信息查询
IPC分类: