Invention Grant
- Patent Title: Printed circuit board
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Application No.: US17712327Application Date: 2022-04-04
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Publication No.: US12004296B2Publication Date: 2024-06-04
- Inventor: Jin Uk Lee , Chi Won Hwang , Eun Sun Kim , Yong Wan Ji , Young Hun You
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210184735 2021.12.22
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02

Abstract:
A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
Public/Granted literature
- US20230199955A1 PRINTED CIRCUIT BOARD Public/Granted day:2023-06-22
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