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    PRINTED CIRCUIT BOARD
    1.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20220322533A1

    公开(公告)日：2022-10-06

    申请号：US17476980

    申请日：2021-09-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Sun Kim ,  Jin Uk Lee ,  Young Hun You ,  Chi Seong Kim

    IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46

    Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

    Printed circuit board
    3.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US12004296B2

    公开(公告)日：2024-06-04

    申请号：US17712327

    申请日：2022-04-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Lee ,  Chi Won Hwang ,  Eun Sun Kim ,  Yong Wan Ji ,  Young Hun You

    IPC: H05K1/11 ,  H05K1/02

    CPC classification number: H05K1/115 ,  H05K1/0218 ,  H05K1/0265 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/096

    Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.

    Printed circuit board
    4.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11758657B2

    公开(公告)日：2023-09-12

    申请号：US17475747

    申请日：2021-09-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Sun Kim ,  Jin Uk Lee ,  Young Hun You

    IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H05K1/09

    CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K1/185

    Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.

    PRINTED CIRCUIT BOARD
    5.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20250024601A1

    公开(公告)日：2025-01-16

    申请号：US18657425

    申请日：2024-05-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Lee ,  Tae Kyung Lee ,  Kee Ju Um ,  Min Gyu Park ,  Young Hun You

    IPC: H05K1/11 ,  H05K1/18

    Abstract: A printed circuit board includes a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer, and a connection structure disposed on or in the substrate portion, the connection structure including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. A distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer.

    Printed circuit board
    7.
    发明授权
    Printed circuit board 有权

    公开(公告)号：US11641715B2

    公开(公告)日：2023-05-02

    申请号：US17476980

    申请日：2021-09-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Sun Kim ,  Jin Uk Lee ,  Young Hun You ,  Chi Seong Kim

    IPC: H05K1/18 ,  H05K1/11 ,  H05K3/46

    Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

    PRINTED CIRCUIT BOARD
    8.
    发明公开
    PRINTED CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230199955A1

    公开(公告)日：2023-06-22

    申请号：US17712327

    申请日：2022-04-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Uk Lee ,  Chi Won Hwang ,  Eun Sun Kim ,  Yong Wan Ji ,  Young Hun You

    IPC: H05K1/11

    CPC classification number: H05K1/115 ,  H05K2201/096

    Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.

    PRINTED CIRCUIT BOARD
    9.
    发明申请
    PRINTED CIRCUIT BOARD 有权

    公开(公告)号：US20230030484A1

    公开(公告)日：2023-02-02

    申请号：US17747653

    申请日：2022-05-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Wan Ji ,  Jin Uk Lee ,  Eun Sun Kim ,  Young Hun You

    IPC: H05K1/11 ,  H05K1/02

    Abstract: A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.

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