-
公开(公告)号：US20220322533A1
公开(公告)日：2022-10-06
申请号：US17476980
申请日：2021-09-16
发明人： Eun Sun Kim , Jin Uk Lee , Young Hun You , Chi Seong Kim
摘要： A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
-
公开(公告)号：US12022613B2
公开(公告)日：2024-06-25
申请号：US17747653
申请日：2022-05-18
发明人： Yong Wan Ji , Jin Uk Lee , Eun Sun Kim , Young Hun You
CPC分类号： H05K1/115 , B32B15/00 , H05K1/0298 , H05K1/11 , H05K2201/09854
摘要： A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.
-
公开(公告)号：US12004296B2
公开(公告)日：2024-06-04
申请号：US17712327
申请日：2022-04-04
发明人： Jin Uk Lee , Chi Won Hwang , Eun Sun Kim , Yong Wan Ji , Young Hun You
CPC分类号： H05K1/115 , H05K1/0218 , H05K1/0265 , H05K1/0298 , H05K2201/0191 , H05K2201/096
摘要： A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
-
公开(公告)号：US11758657B2
公开(公告)日：2023-09-12
申请号：US17475747
申请日：2021-09-15
发明人： Eun Sun Kim , Jin Uk Lee , Young Hun You
摘要： A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.
-
公开(公告)号：US11895771B2
公开(公告)日：2024-02-06
申请号：US17189756
申请日：2021-03-02
发明人： Jin Uk Lee , Young Ook Cho , Eun Sun Kim , Young Hun You
IPC分类号： H05K1/11
CPC分类号： H05K1/113 , H05K2201/096
摘要： A printed circuit board includes: a first insulating layer; a via pad including a first layer embedded in the first insulating layer and a second layer disposed on the first layer; and a first via layer disposed on the via pad, wherein the second layer has a width decreasing in a direction away from the first layer in a stacking direction of the first and second layers.
-
公开(公告)号：US11641715B2
公开(公告)日：2023-05-02
申请号：US17476980
申请日：2021-09-16
发明人： Eun Sun Kim , Jin Uk Lee , Young Hun You , Chi Seong Kim
摘要： A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
-
公开(公告)号：US20230199955A1
公开(公告)日：2023-06-22
申请号：US17712327
申请日：2022-04-04
发明人： Jin Uk Lee , Chi Won Hwang , Eun Sun Kim , Yong Wan Ji , Young Hun You
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K2201/096
摘要： A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
-
公开(公告)号：US20230030484A1
公开(公告)日：2023-02-02
申请号：US17747653
申请日：2022-05-18
发明人： Yong Wan Ji , Jin Uk Lee , Eun Sun Kim , Young Hun You
摘要： A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.
-
公开(公告)号：US11558959B2
公开(公告)日：2023-01-17
申请号：US17230437
申请日：2021-04-14
发明人： Jin Uk Lee , Sangik Cho , Eun Sun Kim , Young Hun You , Jong Eun Park
摘要： A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
-
公开(公告)号：US20220217843A1
公开(公告)日：2022-07-07
申请号：US17230437
申请日：2021-04-14
发明人： Jin Uk Lee , Sangik Cho , Eun Sun Kim , Young Hun You , Jong Eun Park
摘要： A printed circuit board includes an insulating layer, a circuit pattern embedded in the insulating layer and including a first metal layer, a second metal layer and a third metal layer disposed between the first metal layer and the second metal layer, and a connection conductor disposed on one surface of the insulating layer and connected to the circuit pattern, wherein the first metal layer is exposed through the one surface of the insulating layer.
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.013 秒)
