Invention Grant
- Patent Title: Substrate measuring device and a method of using the same
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Application No.: US17855591Application Date: 2022-06-30
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Publication No.: US12007691B2Publication Date: 2024-06-11
- Inventor: Min-Cheng Wu , Chi-Hung Liao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- The original application number of the division: US16049678 2018.07.30
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/42 ; G03F7/00 ; G03F9/00

Abstract:
Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
Public/Granted literature
- US20220334490A1 SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME Public/Granted day:2022-10-20
Information query
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