Invention Grant
- Patent Title: In-chamber low-profile sensor assembly
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Application No.: US17109019Application Date: 2020-12-01
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Publication No.: US12009235B2Publication Date: 2024-06-11
- Inventor: Chuang-Chia Lin , Wenwei Qiao
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/52 ; G01F15/06 ; G01F15/063 ; G01F15/14 ; G01L15/00 ; G01L19/08 ; G01L19/14 ; G01N25/18 ; H01J37/32

Abstract:
A sensor assembly that includes a substrate and a set of sensors. The set of sensor includes pressure sensor and/or flow sensors located across a surface of the substrate. Each respective sensor of the plurality of sensor is adapted to measure a respective pressure or a respective flow of an environment proximate the respective sensor. Each respective sensor of the plurality of sensor may further be adapted to output a respective signal associated with the measured respective pressure or the measured respective flow. The respective signals associated with the measured respective pressure or the measured respective flows measured by the plurality of sensor together provide a pressure distribution across the surface of the substrate and/or a flow distribution across the surface of the substrate.
Public/Granted literature
- US20220172968A1 IN-CHAMBER LOW-PROFILE SENSOR ASSEMBLY Public/Granted day:2022-06-02
Information query
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