- Patent Title: Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substrate
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Application No.: US16275957Application Date: 2019-02-14
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Publication No.: US12021015B2Publication Date: 2024-06-25
- Inventor: Hiroki Tamiya , Koji Kishino , Ryuji Takahashi , Yasunori Hoshino , Takahiro Yamada , Shimpei Obata , Hiroyuki Shiraki , Shinya Arakawa , Shigetoshi Fujita
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Rimon P.C.
- Priority: JP 15071297 2015.03.31
- The original application number of the division: US15071192 2016.03.15
- Main IPC: H01L23/498
- IPC: H01L23/498 ; C08K9/04 ; H01L23/14
Abstract:
A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.
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