发明授权
- 专利标题: Electronic device
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申请号: US17305951申请日: 2021-07-19
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公开(公告)号: US12027444B2公开(公告)日: 2024-07-02
- 发明人: Seiji Yamasaki , Masaaki Bandoh , Shigeru Yuzawa , Hua Wang
- 申请人: LENOVO (SINGAPORE) PTE. LTD.
- 申请人地址: SG Singapore
- 专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人: LENOVO (SINGAPORE) PTE. LTD.
- 当前专利权人地址: SG Singapore
- 代理机构: SHIMOKAJI IP
- 优先权: CN 2010915036.8 2020.09.03
- 主分类号: H01L23/40
- IPC分类号: H01L23/40 ; G06F1/20 ; H05K1/18
摘要:
An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.
公开/授权文献
- US20220068761A1 ELECTRONIC DEVICE 公开/授权日:2022-03-03
信息查询
IPC分类: