- 专利标题: Light-emitting diode chip, display substrate and manufacturing method thereof
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申请号: US17417493申请日: 2020-09-29
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公开(公告)号: US12027648B2公开(公告)日: 2024-07-02
- 发明人: Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
- 申请人: BOE MLED Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE MLED Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: BOE MLED Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing; CN Beijing
- 代理机构: Banner & Witcoff, Ltd.
- 国际申请: PCT/CN2020/118932 2020.09.29
- 国际公布: WO2022/067530A 2022.04.07
- 进入国家日期: 2021-06-23
- 主分类号: H01L33/38
- IPC分类号: H01L33/38 ; H01L25/075 ; H01L33/00 ; H01L33/62
摘要:
A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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