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公开(公告)号：US20240322082A1
公开(公告)日：2024-09-26
申请号：US18733213
申请日：2024-06-04
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L25/075 , H01L33/00 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US20240297283A1
公开(公告)日：2024-09-05
申请号：US18027553
申请日：2022-03-31
发明人： Yuanda Lu , Jiawei Zhao , Zhijun Xiong , Shanwei Yang , Xueqiao Li , Yuanhao Sun , Junjie Ma
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753
摘要： Provided is a light emitting diode chip, including: a base substrate; at least two light emitting units disposed on the base substrate, wherein the at least two light emitting units include adjacent first light emitting unit and second light emitting unit, and each of the first light emitting unit and the second light emitting unit includes: a first semiconductor layer disposed on the base substrate; a light emitting layer disposed on the first semiconductor layer away from the base substrate; and a second semiconductor layer disposed on the light emitting layer away from the base substrate, wherein the light emitting diode chip further includes a bridging part for conducting, and the bridging part is configured to electrically connect the second semiconductor layer of the first light emitting unit with the first semiconductor layer of the second light emitting unit.
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公开(公告)号：US20220336706A1
公开(公告)日：2022-10-20
申请号：US17417493
申请日：2020-09-29
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L33/62 , H01L25/075 , H01L33/00
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US20240339575A1
公开(公告)日：2024-10-10
申请号：US18293834
申请日：2022-11-30
发明人： Yuanda Lu , Junjie Ma , Yuanhao Sun , Jiawei Zhao , Zhijun Xiong , Xueqiao Li , Shanwei Yang , Yutian Chu , Linxia Qi
CPC分类号： H01L33/62 , H01L27/156 , H01L33/005 , H01L33/10 , H01L33/387
摘要： A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.
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公开(公告)号：US12027648B2
公开(公告)日：2024-07-02
申请号：US17417493
申请日：2020-09-29
发明人： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC分类号： H01L33/38 , H01L25/075 , H01L33/00 , H01L33/62
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0016 , H01L2933/0066
摘要： A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US11991825B2
公开(公告)日：2024-05-21
申请号：US16392112
申请日：2019-04-23
发明人： Yuanda Lu , Junjie Ma , Shipeng Wang , Ming Zhai , Jian Sang , Haiwei Sun , Dongjia Hao
CPC分类号： H05K1/118 , H01R12/65 , H05K1/028 , H05K1/111 , H05K2201/09372 , H05K2201/09409 , H05K2201/09418 , H05K2201/09781 , H05K2201/10378
摘要： The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.
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公开(公告)号：US11570343B2
公开(公告)日：2023-01-31
申请号：US16647644
申请日：2019-03-22
发明人： Fei Gao , Xuerong Wang , Lingyun Shi , Lu Yu , Lei Chen , Junjie Ma , Xuqing Feng , Pengfei Cheng , Xin Ma , Yuanda Lu , Haixu Li
摘要： The present disclosure provides a floating touch camera module, a display device and a touch method. The floating touch camera module includes: a lens with a light collection surface and a light emitting surface; an image sensor at one side of the light emitting surface of the lens, the image sensor configured to receive light rays from the lens and form sensing information; and an infrared cut filter film at one side of a light incident surface of the image sensor and configured to filter out infrared light rays. The infrared cut filter film is movable relative to the lens between a first position at which the infrared cut filter film directly faces the lens and a second position at which the infrared cut filter film is offset from the lens, thereby enabling the floating touch camera module to switch between a photographing mode and a touch mode.
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公开(公告)号：US11131797B2
公开(公告)日：2021-09-28
申请号：US16834092
申请日：2020-03-30
发明人： Jinpeng Li , Ming Zhai , Pei Li , Zhiyuan Wang , Pengjun Cao , Jian Li , Teng Zhang , Zongying Shu , Yuanda Lu , Linxia Qi , Pei Qin
IPC分类号： F21V8/00 , F21V13/00 , F21Y115/10
摘要： Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.
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公开(公告)号：US10928562B2
公开(公告)日：2021-02-23
申请号：US16241394
申请日：2019-01-07
发明人： Shubai Zhang , Pengfei Cheng , Haiwei Sun , Junjie Ma , Yutao Hao , Yuanda Lu , Zhen Wang
IPC分类号： G02B5/02 , G02B5/04 , G02F1/1335 , G02F1/13357
摘要： An optical film element, a backlight and a display device are disclosed. The optical film element includes a transparent base and a first diffusion film located at a first surface of the transparent base; the optical film element further includes an optical functional layer located at a second surface of the transparent base opposite to the first surface; the optical functional layer includes transmission regions and reflection regions; reflection members are provided in the reflection regions.
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公开(公告)号：US10884180B2
公开(公告)日：2021-01-05
申请号：US16103984
申请日：2018-08-16
发明人： Heling Zhu , Junjie Ma , Yuanda Lu , Bo Han , Liang Gao , Lu Yu , Pengfei Cheng
IPC分类号： F21V8/00
摘要： A light guide assembly comprises: a first light guide member; and a second light guide member stacked on the first light guide member. The light guide assembly has first and second light incident surfaces located on different sides, and a light emitting surface and a bottom surface which are oppositely disposed in a thickness direction, the first light incident surface and the bottom surface are located on the first light guide member, and the second light incident surface and the light emitting surface are located on the second light guide member, and the bottom surface is provided with first dots having a density increasing in a direction away from the first light incident surface, and the light emitting surface is provided with second dots having a density increasing in a direction away from the second light incident surface.
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