- 专利标题： Resonance apparatus for processing electrical loss using conductive material and method for manufacturing the same
-
申请号： US17245545申请日： 2021-04-30
-
公开(公告)号： US12028048B2公开(公告)日： 2024-07-02
- 发明人: Hosoo Park , Duck Hwan Kim , Chul Soo Kim , Sang Uk Son , In Sang Song , Jeashik Shin , Moonchul Lee
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： NSIP Law
- 优先权： KR 20120100437 2012.09.11
- 主分类号： H03H9/54
- IPC分类号： H03H9/54 ; H03H9/02 ; H03H9/13 ; H03H9/17 ; H10N30/06 ; H10N30/87
摘要：
A resonance apparatus that processes an electrical loss using a conductive material and a method of manufacturing the resonance apparatus are provided. The resonance apparatus includes a lower electrode formed at a predetermined distance from a substrate, and a piezoelectric layer formed on the lower electrode. The resonance apparatus further includes an upper electrode formed on the piezoelectric layer, and a conductive layer formed on the upper electrode or the lower electrode.
公开/授权文献
信息查询
IPC分类:
