- 专利标题: Method of forming the spacers on lateral flanks of a transistor gate using successive implantation phases
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申请号: US17652324申请日: 2022-02-24
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公开(公告)号: US12033859B2公开(公告)日: 2024-07-09
- 发明人: Valentin Bacquie , Nicolas Posseme
- 申请人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 申请人地址: FR Paris
- 专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人地址: FR Paris
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: FR 01864 2021.02.25
- 主分类号: H01L21/28
- IPC分类号: H01L21/28 ; H01L21/3115
摘要:
A method is provided for forming spacers of a gate of a transistor, including: providing an active layer surmounted by a gate; forming a dielectric layer covering the gate and the active layer, the dielectric layer having lateral portions and basal portions; anisotropically modifying the basal portions by implantation of light ions, forming modified basal portions; and removing the modified basal portions by selective etching, so as to form the spacers on the lateral flanks of the gate from the unmodified lateral portions, in which, before the removing step, the anisotropic modification of the basal portions includes n successive implantation phases having implantation energies Γi (i=1 . . . n) which are distinct from each other, the n phases being configured to implant the light ions at different nominal implantation depths.
公开/授权文献
- US20220270880A1 METHOD OF FORMING THE SPACERS OF A TRANSISTOR GATE 公开/授权日:2022-08-25
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