Invention Grant
- Patent Title: Semiconductor device, method for manufacturing the same, or display device including the same
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Application No.: US16520831Application Date: 2019-07-24
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Publication No.: US12034080B2Publication Date: 2024-07-09
- Inventor: Junichi Koezuka , Kenichi Okazaki , Yasuharu Hosaka , Masami Jintyou , Takahiro Iguchi , Shunpei Yamazaki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP 15040981 2015.03.03 JP 15052903 2015.03.17 JP 15127835 2015.06.25 JP 15239875 2015.12.09
- The original application number of the division: US15058832 2016.03.02
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/02 ; H01L27/12 ; H01L29/04 ; H01L29/24 ; H01L29/66

Abstract:
To suppress a change in electrical characteristics in a transistor including an oxide semiconductor film. The transistor includes a first gate electrode, a first insulating film, an oxide semiconductor film, a source electrode, a drain electrode, a second insulating film, a second gate electrode, and a third insulating film. The oxide semiconductor film includes a first oxide semiconductor film on the first gate electrode side, and a second oxide semiconductor film over the first oxide semiconductor film. The first oxide semiconductor film and the second oxide semiconductor film include In, M, and Zn (M is Al, Ga, Y, or Sn). In a region of the second oxide semiconductor film, the number of atoms of In is smaller than that in the first oxide semiconductor film. The second gate electrode includes at least one metal element included in the oxide semiconductor film.
Information query
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