Invention Grant
- Patent Title: Electronic component manufacturing method
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Application No.: US17488026Application Date: 2021-09-28
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Publication No.: US12035643B2Publication Date: 2024-07-09
- Inventor: Yann Canvel , Sebastien Lagrasta , Sebastien Barnola , Christelle Boixaderas
- Applicant: STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Crolles
- Agency: Seed IP Law Group LLP
- Priority: FR 58603 2018.09.21
- Main IPC: H10N70/00
- IPC: H10N70/00 ; H10N70/20
Abstract:
The disclosure concerns an electronic component manufacturing method including a first step of etching at least one first layer followed, with no exposure to oxygen, by a second step of passivating the first layer.
Public/Granted literature
- US20220020924A1 ELECTRONIC COMPONENT MANUFACTURING METHOD Public/Granted day:2022-01-20
Information query
