- 专利标题: Printed circuit board, communications device, and manufacturing method
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申请号: US17689318申请日: 2022-03-08
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公开(公告)号: US12058808B2公开(公告)日: 2024-08-06
- 发明人: Wenliang Li , Zewen Wang , Xusheng Liu , Ertang Xie , Zhong Yan , Wang Xiong
- 申请人: Huawei Technologies Co., Ltd.
- 申请人地址: CN Shenzhen
- 专利权人: HUAWEI TECHNOLOGIES CO., LTD.
- 当前专利权人: HUAWEI TECHNOLOGIES CO., LTD.
- 当前专利权人地址: CN Shenzhen
- 代理机构: Conley Rose, P.C.
- 优先权: CN 1910864686.1 2019.09.09
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11
摘要:
A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.
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