公开(公告)号：US12058808B2

公开(公告)日：2024-08-06

申请号：US17689318

申请日：2022-03-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wenliang Li ,  Zewen Wang ,  Xusheng Liu ,  Ertang Xie ,  Zhong Yan ,  Wang Xiong

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K2201/0338

Abstract: A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.

公开(公告)号：US20220192007A1

公开(公告)日：2022-06-16

申请号：US17689318

申请日：2022-03-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wenliang Li ,  Zewen Wang ,  Xusheng Liu ,  Ertang Xie ,  Zhong Yan ,  Wang Xiong

IPC: H05K1/02 ,  H05K1/11

Abstract: A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.

公开(公告)号：US11019724B2

公开(公告)日：2021-05-25

申请号：US16727402

申请日：2019-12-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Feng Gao ,  Ertang Xie ,  Wei Jing

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

Abstract: This application provides a multilayer printed circuit board (PCB). There is a pad array on a surface of the multilayer PCB. The pad array includes at least one padding unit, and each padding unit includes a first pad and a second pad that are adjacent. Both the first pad and the second pad are connected to a first Z-directed transmission line located in a Z-directed groove. In this way, to wire a signal wire on a signal layer of the multilayer PCB, a quantity of Z-directed grooves that need to be bypassed is less than a quantity of vias that need to be bypassed in the prior art. In other words, wiring of the signal wire is easier to some extent. In addition, this application further provides a corresponding communications device.