Invention Grant
- Patent Title: Ceramic electronic component
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Application No.: US18237555Application Date: 2023-08-24
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Publication No.: US12062494B2Publication Date: 2024-08-13
- Inventor: Hee Sun Chun , Hui Sun Park , Tae Hyung Kim , Jeong Wook Seo , Hyo Ju Lee , Hyeg Soon An , Jin Woo Kim , Seok Hyun Yoon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210141261 2021.10.21
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/008 ; H01G4/012 ; H01G4/30

Abstract:
A ceramic electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode. At least a region of the dielectric layer includes tin (Sn) and a lanthanide rare earth element (RE) including dysprosium (Dy). In the at least a region of the dielectric layer, a molar ratio of tin (Sn) to dysprosium (Dy) is from 0.15 to 0.30.
Public/Granted literature
- US20230411076A1 CERAMIC ELECTRONIC COMPONENT Public/Granted day:2023-12-21
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