- 专利标题: Semiconductor device
-
申请号: US17468252申请日: 2021-09-07
-
公开(公告)号: US12062651B2公开(公告)日: 2024-08-13
- 发明人: Yasuhiro Isobe , Hung Hung , Akira Yoshioka , Toru Sugiyama , Hitoshi Kobayashi , Tetsuya Ohno , Masaaki Iwai , Naonori Hosokawa , Masaaki Onomura
- 申请人: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 代理机构: Maier & Maier, PLLC
- 优先权: JP 20151229 2020.09.09
- 主分类号: H01L25/18
- IPC分类号: H01L25/18 ; H01L25/07 ; H01L25/16 ; H01L29/778 ; H03K17/687 ; H01L23/00
摘要:
A semiconductor device according to an embodiment includes: a first nitride semiconductor layer having a first surface and a second surface; a first source electrode provided on the first surface; a first drain electrode provided on the first surface; a first gate electrode provided on the first surface between the first source electrode and the first drain electrode; a second nitride semiconductor layer having a third surface and a fourth surface, the third surface being provided on the second surface and facing the second surface, and the second nitride semiconductor layer having a smaller band gap than the first nitride semiconductor layer; and a first semiconductor device having a fifth surface provided on the fourth surface and facing the fourth surface with a size equal to or smaller than a size of the fourth surface, the first semiconductor device including a first semiconductor material having a smaller band gap than the second nitride semiconductor layer.
公开/授权文献
- US20220077131A1 SEMICONDUCTOR DEVICE 公开/授权日:2022-03-10
信息查询
IPC分类: