Invention Grant
- Patent Title: Hyperchip
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Application No.: US18378978Application Date: 2023-10-11
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Publication No.: US12074138B2Publication Date: 2024-08-27
- Inventor: Mark T. Bohr , Wilfred Gomes , Rajesh Kumar , Pooya Tadayon , Doug Ingerly
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- The original application number of the division: US17226967 2021.04.09
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L23/522 ; H01L23/538

Abstract:
Hyperchip structures and methods of fabricating hyperchips are described. In an example, an integrated circuit assembly includes a first integrated circuit chip having a device side opposite a backside. The device side includes a plurality of transistor devices and a plurality of device side contact points. The backside includes a plurality of backside contacts. A second integrated circuit chip includes a device side having a plurality of device contact points thereon. The second integrated circuit chip is on the first integrated circuit chip in a device side to device side configuration. Ones of the plurality of device contact points of the second integrated circuit chip are coupled to ones of the plurality of device contact points of the first integrated circuit chip. The second integrated circuit chip is smaller than the first integrated circuit chip from a plan view perspective.
Public/Granted literature
- US20240038722A1 HYPERCHIP Public/Granted day:2024-02-01
Information query
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