Invention Grant
- Patent Title: RFIC assembled antenna
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Application No.: US18047089Application Date: 2022-10-17
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Publication No.: US12074360B2Publication Date: 2024-08-27
- Inventor: Byoung Nam Kim , Hong Il Yoo , Chul-Keun Park , Chan-Woo Park
- Applicant: SENSORVIEW CO., LTD.
- Applicant Address: KR Seongnam-si
- Assignee: SENSORVIEW CO., LTD.
- Current Assignee: SENSORVIEW CO., LTD.
- Current Assignee Address: KR Seongnam-si
- Priority: KR 20210141695 2021.10.22 KR 20220012395 2022.01.27
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; G06K19/077 ; H01Q1/38

Abstract:
An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.
Public/Granted literature
- US20230129616A1 RFIC ASSEMBLED ANTENNA Public/Granted day:2023-04-27
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