RFIC assembled antenna
    1.
    发明授权

    公开(公告)号:US12074360B2

    公开(公告)日:2024-08-27

    申请号:US18047089

    申请日:2022-10-17

    CPC classification number: H01Q1/2283 G06K19/0775 H01Q1/38

    Abstract: An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.

    Horn antenna for millimeter wave
    2.
    发明授权

    公开(公告)号:US12224490B2

    公开(公告)日:2025-02-11

    申请号:US18171725

    申请日:2023-02-21

    Abstract: A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator.

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