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公开(公告)号：US12224490B2
公开(公告)日：2025-02-11
申请号：US18171725
申请日：2023-02-21
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam Kim , Hong Il Yoo , Chul-Keun Park , Chan-Woo Park , Kyung Hwan Kim
Abstract: A horn antenna for a millimeter wave comprises: a horn radiator including a radiation part having an opening formed therein to radiate a feed signal, and a multi-layer PCB coupling part coupled to lower and side portions of the radiation part to provide a feed signal; and a multi-layer PCB coupled to a lower portion of the multi-layer PCB coupling part to provide a feed signal, wherein a slot and a groove connected to the slot and extending in a direction parallel to the multi-layer PCB are formed in the multi-layer PCB coupling part, wherein a feed line vertically overlapping the slot and the groove is formed on a first layer substrate, which is the uppermost layer of the multi-layer PCB, wherein the opening extends in a direction parallel to the multi-layer PCB, and wherein a ‘¬’-shaped waveguide extending from the slot is formed in the horn radiator.
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公开(公告)号：US12074360B2
公开(公告)日：2024-08-27
申请号：US18047089
申请日：2022-10-17
Applicant: SENSORVIEW CO., LTD.
Inventor： Byoung Nam Kim , Hong Il Yoo , Chul-Keun Park , Chan-Woo Park
IPC: H01Q1/22 , G06K19/077 , H01Q1/38
CPC classification number: H01Q1/2283 , G06K19/0775 , H01Q1/38
Abstract: An RFIC assembled antenna comprises: a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot, wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.
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