A cover member of an electronic device according to various embodiments of the present disclosure may comprise: a substrate film layer; a metal oxide layer disposed on the upper surface of the substrate film layer and formed by sputtering; a transparent member attached/disposed on the upper surface of the metal oxide layer; a primer layer disposed on the lower surface of the substrate film layer and made of a semi-transparent material; and a photocurable resin layer disposed on the lower surface of the primer layer, the photocurable resin layer comprising, on a surface thereof, a pattern structure in a designated stereoscopic shape. Other embodiments are also possible.