Invention Grant
- Patent Title: Method for manufacturing film-formed molded product
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Application No.: US17420715Application Date: 2019-12-24
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Publication No.: US12083722B2Publication Date: 2024-09-10
- Inventor: Takao Umezawa , Hitoshi Konuma , Mitsunori Sato
- Applicant: MITSUBA Corporation
- Applicant Address: JP Gunma
- Assignee: MITSUBA Corporation
- Current Assignee: MITSUBA Corporation
- Current Assignee Address: JP Gunma
- Agency: JCIPRNET
- Priority: JP 19003263 2019.01.11
- International Application: PCT/JP2019/050500 2019.12.24
- International Announcement: WO2020/145123A 2020.07.16
- Date entered country: 2021-07-05
- Main IPC: B29C45/16
- IPC: B29C45/16 ; B29C45/00 ; B29C45/04 ; B29C45/06 ; B29C45/14 ; C23C14/34 ; C23C14/50 ; B29L9/00 ; B29L31/34

Abstract:
The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product between a movable mold and a fixed mold; and then forming the metal coating film which covers the molded product by a film-forming part of a second mold without taking the molded product out from between the movable mold and the fixed mold. The metal coating film is capable of transmitting electromagnetic waves therethrough as a result of generation of cracks after being formed.
Public/Granted literature
- US20220105667A1 METHOD FOR MANUFACTURING FILM-FORMED MOLDED PRODUCT Public/Granted day:2022-04-07
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